A Design Method to Improve Temperature Uniformity on Wafer for Rapid Thermal Processing

A Learning Approach of Wafer Temperature Control in a Rapid Thermal Processing System

This paper presents a learning approach for wafer temperature control in a rapid thermal processing system (RTP). RTP is very important for semiconductor processing system and requires an accurate trajectory following. Numerous studies have addressed this problem and most research on this problem requires exact knowledge of the system dynamics. The various approaches do not guarantee the desire...

Method to improve spatial uniformity with lightpipes.

A heuristic method to obtain lightpipes that provide both collimation and good spatial uniformity is proposed. The change in shape that is likely to improve spatial uniformity, with minimal efficiency loss, can be predicted. Several case studies where this technique has been used are presented.

Pulsed plasmas as a method to improve uniformity during materials processing

Continuous wave operation of inductively coupled plasma ~ICP! reactors as used for materials processing and which have geometrical or flow asymmetries may produce asymmetric species densities, temperatures, and fluxes. Flow asymmetries that produce nonuniformities in plasma conductivity initiate a positive feedback loop. In this feedback loop, asymmetries in conductivity are reinforced by the r...

Thermal Uniformity-Aware Application Mapping for Network-on-Chip Design

Ensuring thermal-uniformity in an integrated circuit chip is very essential for its correct operation. Thus, in the Networkon-Chip (NoC) based system design as well, it is essential to attach cores of the application core graph to the routers in the topology graph so that thermal uniformity across the chip is maintained. However, the performance of the application should not be sacrificed to a ...

Temperature Control and Modeling of Rapid Thermal Processing